Puhui T962 Component SMD Reflow Oven
- Power supply 220 V AC / 110 V; 50-60 Hz
- Rated Power 800W
- Soldering cycle time from 1 to 8 minutes
- Temperature range 0-280 ° C
- Working area size 180x235 mm
- Overall dimensions 375x240x375 mm
- Gross weight 7 kg
- Size: 375mm x 375mm x 240mm
| Count | Price | |||
|---|---|---|---|---|
| From | 1 | шт | 14700 | грн |
| From | 2 | шт | 14406 | грн |
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We are pleased to introduce you the Puhui T962 SMD reflow oven.
Puhui T962 SMD Reflow Oven is an efficient device for reflowing SMD and BGA components on a board.
The heating in the SMD reflow oven of Puhui T962 components is carried out thanks to infrared radiation, which acts over a fairly large area. The maximum effective reflow area is 180x235 mm.
Puhui T962 SMD Reflow Oven has a choice of different soldering cycles. Preset parameters for eight brazing cycles, the process is fully automated, from preheating to cooling.
The Puhui T962 SMD reflow oven is equipped with powerful heating elements rated at 800 watts, which allows it to reflow solder on devices with ease.
Puhui T962 SMD Component Reflow Oven can be used to repair damaged solder joints, remove / replace damaged components, and create small engineering products or prototypes.
Puhui T962 SMD reflow oven has a fairly compact size and efficiently copes with its tasks.
You can buy Puhui T962 SMD Component Reflow Oven on our website or by phone.
