Desoldering vacuum (suction solder)
Features:
- Housing: Metall
- Peak-power
- inner nozzle diameter: 3.5 mm
- Weight: 111 g
| Count | Price | |||
|---|---|---|---|---|
| From | 1 | шт | 123 | грн |
| From | 8 | шт | 121 | грн |
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Desoldering vacuum (suction solder) is designed to remove the solder during mounting of electronic components.
is a vacuum pump for drawing the tip of the molten solder with the surface being treated. The vacuum pump is realized in the form of a spring-loaded piston with a detent position in its cocked position, with the tip of the input channel to form the constriction.
The operating principle of Desoldering vacuum (suction solder): solder in place solder is melted, bring cocked suction, press the shutter release button, the spring pushes the piston differential pressure sucks the solder inside, releasing details on the board.
All metal construction Desoldering vacuum (suction solder) are ideal for heavy use, including the production of rework and repair.
The tool is easy to disassemble for quick cleaning.
Desoldering vacuum provides a simple and safe dismantling of connections, printed circuit boards and components.